Chip & Wire

Do you have problems maximising the packing density of your naked die integration process, including wire bonding and packaging?

Technograph has a proven, long established track record in delivering the most miniaturised microelectronic solutions currently achievable using state-of-the-art chip and wire design and assembly techniques in its key markets of aerospace, defence, automotive, telecoms industrial and medical.

This includes the ability to precision die attach and wire bond onto a variety of substrates using a wide range of bonding materials including Gold or Aluminium - down to a wire diameter of just 17 microns.