Chip & wire

Chip & wire is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and it's packaging during semiconductor device fabrication.

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Do you have problems maximising the packing density of your naked die integration process, including wire bonding and packaging?

We have the ability to precision die attach and wire bond onto a variety of substrates using a wide range of bonding materials including gold or aluminium - down to a wire diameter of just 17 microns.

Technograph is the solution

We deliver the most miniaturised microelectronic solutions currently achievable using state-of-the-art chip and wire design and assembly techniques.

Why?

We have a proven, long established track record in these markets:

 

  • Aerospace
  • Defence
  • Automotive
  • Telecoms
  • Industrial
  • Medical