Chip & wire
Chip & wire is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and it's packaging during semiconductor device fabrication.
Do you have problems maximising the packing density of your naked die integration process, including wire bonding and packaging?
We have the ability to precision die attach and wire bond onto a variety of substrates using a wide range of bonding materials including gold or aluminium - down to a wire diameter of just 17 microns.
Technograph is the solution
We deliver the most miniaturised microelectronic solutions currently achievable using state-of-the-art chip and wire design and assembly techniques.
We have a proven, long established track record in these markets: