Thick film hybrids

An alternative to a Printed Circuit Board (PCB), generally smaller, more secure and more robust than a PCB. A hybrid can work in water, under sand or in extreme heat conditions, in most cases a PCB can’t.


Do you have a problem with system weight, ruggedness, thermal management or size?

Thick film hybrids are circuits formed on alumina substrates with fine line screen printed interconnect and resistor structures. These can be multi-layer with conductive vias providing very high density substrates.

The resistors can also be laser trimmed to give high tolerance or actively trimmed, in-circuit, to give precise circuit performance.

Packaged, discrete, or naked components can then be assembled to provide very high levels of integration with good power dissipation. The populated substrate can then be integrated into a metal package to provide a highly robust and reliable electronic system.

Technograph is the solution

We provide the complete solution comprising substrate, printing, chip and wire assembly, packaging test and reliability screening.


We have over 20 years of experience in the design and building of thick film hybrid products.

We have provided solutions for high reliability applications in these sectors:

  • Aerospace
  • Defence
  • Automotive
  • Telecoms
  • Medical