Thick Film Hybrids

Do you have a problem with system weight, ruggedness, thermal management or size?

If so Technograph can provide a timely and cost effective solution using completely proven and established thick film hybrid technology.

Thick film hybrids are circuits formed on alumina substrates with fine line screen printed interconnect and resistor structures. These can be multi-layer with conductive vias providing very high density substrates. The resistors can also be laser trimmed to give high tolerance or actively trimmed, in-circuit, to give precise circuit performance. Packaged, discrete or naked components can then be on assembled to provide very high levels of integration with good power dissipation. The populated substrate can then be integrated into a metal package to provide a highly robust and reliable electronic system.

Technograph has over 20 years of experience in the design and building of thick film hybrid products for aerospace, defence, automotive, telecoms and other high reliability applications such as medical.

Technograph provides the complete solution comprising substrate, printing, chip and wire assembly, packaging test and reliability screening.